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小米芯片

玄戒 O1

  • 首发小米 15S Pro
  • TSMC N3E
  • 109 mm^2
  • CPU:
    • 2x X925 @ 3.9 GHz
    • 4x A725 @ 3.4 GHz
    • 2x A725 @ 1.9 GHz
    • 2x A520 @ 1.8 GHz
    • 16MB shared L3
  • GPU:
    • Immortalis-G925 MC16 @ 1392 MHz
    • 4MB L2
  • NPU:
    • 6 core
    • 10MB Cache

来源:

玄戒 O3

  • 首发小米 MIX Fold 5
  • TSMC N3P
  • 138.3 mm^2 (133 mm^2 ?)
  • CPU:
    • 2x C1-Ultra @ 4.35 GHz
    • 4x C1-Premium @ 3.6 GHz
    • 4x C1-Pro @ 3.15 GHz
    • 16MB shared L3
    • 2x SME2 unit
  • 16MB SLC
  • GPU:
    • Mali G2 Ultra NX MC16 @ 1.6 GHz
    • 8 NX (tensor core)
    • 32.754 mm^2
  • NPU:
    • 4 core
    • 8MB L2
    • 200 TOPs INT4
  • LPDDR5X/LPDDR6

来源:

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